Temporary protective film for manufacturing semiconductor devices



FIG. 1 is a perspective view of a temporary protective film formanufacturing semiconductor devices of the present invention;

FIG. 2 is a front view of the thereof.

FIG. 3 is a rear view of the thereof.

FIG. 4 is a top view of the thereof.

FIG. 5 is a bottom view of the thereof.

FIG. 6 is a left side view of the thereof.

FIG. 7 is a right side view of the thereof; and,

FIG. 8 is a sectional view taken along the line 8-8 of FIG. 6 .

CLAIM The ornamental design for a temporary protective film formanufacturing semiconductor devices, as shown and described.